Admission to the MUD Programme is competitive. Approximately 30-36 students enrol each year from the applicant pool. Most applicants have strong academic background in the fields of architecture, landscape architecture, urban planning and related discipline. Some have professional experiences. Applicants are urged to focus on design portfolio, which is an important document in the admission procedure. However, for applicants that hold a degree with distinction (or equivalent), other subjects will also be considered. All online application forms and supporting materials must be received by 12:00 noon, 31 December 2020 via the University’s online application system (https://aal.hku.hk/tpg/programme-list-2122) and the Faculty’s MUD Application Documents Submission System (https://extranet.ad.arch.hku.hk/Admission/MUD) respectively.
MUD offer email will be sent by the end of March 2021 or earlier. A confirmation letter will be sent by the end of April 2021 or earlier. The University thanks the applicants for their interest but advises that only candidates shortlisted by 31 May 2021 at the latest will be notified of the application results.
The composition fees for the Master of Urban Design in the academic year 2021-2022 is HK$ 224,220. The composition fees only cover tuition fees for courses on offer and student’s usage of University facilities, such as health clinic, sports centre and library facilities. It does not include fees such as costs for local and international field trips, printing, binding, stationery, books and model building.
A new studio space at the 8/F Knowles Building is provided to MUD teaching activities and student work. Students can benefit from the facilities and technical know-how of Department of Urban Planning and Design, Landscape, Real Estate and Architecture. Students also could access the latest Digital Fabrication Laboratory and other workshop facilities in the Department of Architecture.
Application from a list of developing countries in Asia and the Pacific are eligible to apply for the Asian Development Bank – Japan Scholarship Program (ADB-JSP). Application for the Joint Japan/World Bank Graduate Scholarship Program (JJWBGSP) is open to worldwide developing countries. The ADB-JSP & JJWBGSP provide financial assistance to well-qualified candidates to pursue postgraduate studies in city and building-related fields. The Scholarship covers tuition fees, international fieldtrip and living expenses during the study in Hong Kong. For ADB-JSP scholarship, please see: https://www.adb.org/site/careers/japan-scholarship-program/main. For JJWBGSP scholarship, please see: https://www.worldbank.org/en/programs/scholarships or contact MUD admission officer. Applicants from Hong Kong and Mainland China are ineligible for ADB-JSP & JJWBGSP scholarship.